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Characterization of Minerals, Metals, and Materials 2023

BookPaperback
EUR320,00

Product description

The collection focuses on the advancements of characterization of minerals, metals, and materials and the applications of characterization results on the processing of these materials. Advanced characterization methods, techniques, and new instruments are emphasized. Areas of interest include, but are not limited to:
· Extraction and processing of various types of minerals, process-structure-property relationship of metal alloys, glasses, ceramics, polymers, composites, semiconductors, and carbon using as functional and structural materials.

· Novel methods and techniques for characterizing materials across a spectrum of systems and processes.
· Characterization of mechanical, thermal, electrical, optical, dielectric, magnetic, physical, and other properties of materials.


· Characterization of structural, morphological, and topographical natures of materials at micro- and nano- scales.

· Characterization of extraction and processing including process development and analysis.
· Advances in instrument developments for microstructure analysis and performance evaluation of materials, such as computer tomography (CT), X-ray and neutron diffraction, electron microscopy (SEM, FIB, TEM), and spectroscopy (EDS, WDS, EBSD) techniques.


· 2D and 3D modelling for materials characterization.
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Details

ISBN/GTIN978-3-031-22578-9
Product TypeBook
BindingPaperback
PublisherSpringer
Publication townCham
Publication countrySwitzerland
Publishing date12/02/2024
Edition1st ed. 2023
Pages621 pages
LanguageEnglish
Illustrations59 s/w Abbildungen, 305 farbige Abbildungen
Article no.27986908
CatalogsVLB
Data source no.31a33396db7b41268354a2d007a0f8fa
Product groupBU682
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Author

Mingming Zhang, Wood Mackenzie; Zhiwei Peng, Central South University; Jian Li, CanmetMATERIALS; Bowen Li, Michigan Technological University; Sergio Neves Monteiro, Instituto Militar de Engenharia; Rajiv Soman, Eurofins EAG Materials Science LLC; Jiann-Yang Hwang, Michigan Technological University; Yunus Eren Kalay, Middle East Technical University; Juan P. Escobedo-Diaz, University of New South Wales; John S. Carpenter, Los Alamos National Laboratory; Andrew D. Brown, DEVCOM U.S. Army Research Laboratory; Shadia Ikhmayies, Al Isra University

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